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Materials & Metallurgy

What the material tells you that the component cannot.

Aremac Labs characterises metals, polymers, ceramics, and composites at the microstructural level to identify degradation mechanisms, fracture origins, contamination, and coating failures that drive product failure in the field.

From the Zeiss SEM — actual case work

Four material systems, four different failure signatures. All images acquired at Aremac Labs on a Zeiss field emission SEM, February 2024.

SEM image of polymer fracture surface showing delamination and cracking at 3500x magnification, 10 micron scale, Zeiss SEM SE2 signal at 1kV
Polymer Fracture & Delamination Mag 3.50 KX · 10µm · SE2 · 1.00 kV
SEM image of battery anode material showing granular active material morphology and particle distribution at 2000x magnification, 10 micron scale
Battery Anode Active Material Morphology Mag 2.00 KX · 10µm · SE2 · 2.00 kV
SEM image of semiconductor chip surface showing cracking and fracture at die corner at 3500x magnification, 10 micron scale
Semiconductor Die Corner Fracture Mag 3.50 KX · 10µm · SE2 · 1.00 kV
SEM image of glass fracture surface showing transgranular crack propagation and surface roughness at 1000x magnification, 10 micron scale
Glass Fracture Surface Morphology Mag 1.00 KX · 10µm · SE2 · 5.00 kV

Zeiss field emission SEM · SE2 signal · All images from actual case work — component and client details withheld

Electronics failures frequently originate at the material level — in a coating that loses adhesion, a polymer that degrades under thermal cycling, a solder alloy that develops fatigue cracks, or a glass substrate that fractures from residual stress. Understanding why a material behaved the way it did requires characterisation at the microstructural scale, not just visual inspection. Aremac Labs applies scanning electron microscopy, energy dispersive X-ray spectroscopy, and optical microscopy to reveal what standard inspection methods miss.

Material systems we analyse

Our materials analysis covers the full range of materials found in consumer electronics and related industries. Each material system presents distinct failure modes that require different analytical approaches and interpretation frameworks.

01 — Metals & Alloys

Fatigue, fracture, and corrosion

Solder alloys, copper leadframes, aluminium housings, steel fasteners, and contact metals. We identify fatigue striations, corrosion morphology, intermetallic growth, and grain boundary failure under SEM and characterise composition with EDX.

02 — Polymers

Degradation, cracking, and delamination

Encapsulants, adhesives, conformal coatings, cable insulation, and structural plastics. We assess fracture surface morphology to differentiate brittle failure, ductile failure, fatigue, and environmental stress cracking.

03 — Glass & Ceramics

Fracture origin and propagation

Cover glass, ceramic substrates, and piezoelectric components. SEM examination of fracture surfaces identifies crack origin, propagation direction, and whether failure was mechanical, thermal, or residual stress driven.

04 — Battery Materials

Electrode morphology and degradation

Cathode and anode active materials, separators, and current collectors from lithium ion cells. We assess particle cracking, SEI layer formation, lithium plating, and binder degradation to understand capacity fade and safety incidents.

05 — Coatings & Films

Adhesion, thickness, and composition

Conformal coatings, surface finishes, thin films, and protective layers. Cross-section preparation followed by SEM and EDX mapping reveals delamination interfaces, porosity, and compositional gradients through the coating thickness.

06 — Contamination

Foreign material identification

Particles, residues, and deposits on component surfaces. EDX elemental mapping identifies contamination sources — flux residues, corrosion products, manufacturing debris, or environmental deposits — to trace origin and corrective action.

How materials analysis connects to root cause

Material characterisation is rarely the end of an investigation — it is the step that makes the root cause definitive. A corroded contact surface tells you that moisture was present; EDX tells you whether the corrosion product is chloride-driven, sulphur-driven, or galvanic. A cracked polymer tells you the failure was mechanical; fracture surface morphology tells you whether it was fatigue, impact, or stress cracking. Without the material evidence, root cause remains an opinion. With it, root cause is a finding.

SEM Analysis EDX / EDS Fracture Analysis Corrosion Polymer Failure Battery Materials Glass Fracture Coating Analysis Contamination ID XRD

Common questions

What is the difference between EDX and XRD for materials analysis?

EDX (energy dispersive X-ray spectroscopy) identifies elemental composition at a specific point or area on a sample surface — it tells you what elements are present. XRD (X-ray diffraction) identifies crystalline phases and crystal structure — it tells you what compounds those elements form. For corrosion analysis, EDX identifies the elements in a corrosion product while XRD confirms whether it is, for example, cuprous oxide or cuprous chloride. Both techniques complement SEM imaging and together provide a complete materials picture.

Can you identify foreign particle contamination on a component surface?

Yes. EDX analysis of a foreign particle or deposit provides an elemental fingerprint that we use to identify likely sources — flux residues, metallic debris, environmental particulates, corrosion products, or manufacturing contamination. Particle morphology under SEM (rounded vs angular, fibrous vs crystalline) adds further information about origin. We have identified contamination from machining swarf, cleaning agent residues, airborne mineral deposits, and biological material in past investigations.

Can you analyse materials from products that have been in the field for years?

Yes, and field-aged samples are often the most informative. Materials that have been in service accumulate environmental exposure, thermal cycling, mechanical fatigue, and chemical attack that laboratory samples do not capture. We routinely analyse components that have been in service for months to years and compare their microstructural condition against expected or nominal material state to identify what degradation mechanisms were active.

Do you need a large sample or can you work with small fragments?

SEM and EDX can analyse very small samples — fragments a few millimetres across are routinely examined. For fracture surface analysis, it is important to protect the fracture surface during handling and shipping; contact us before preparing or cleaning the sample. For coating or cross-section analysis, we prepare the sample ourselves from the component you send.

Can materials analysis support a supplier dispute or warranty claim?

Yes. Identifying whether a failure originated in the material supplied, the manufacturing process, or end-use conditions is exactly the kind of question materials analysis answers — and with SEM images and EDX data as physical evidence, the findings are defensible in commercial negotiations, arbitration, or legal proceedings. We have supported supplier corrective action requests and warranty claim disputes for electronics OEMs and contract manufacturers.

Need a material failure explained?

Send us the component or sample. We will tell you what the material is doing and why.

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