Printed circuit board assembly failures are rarely straightforward. A solder joint that looks intact under optical inspection may be cracked at the interface. Corrosion visible on the surface may have started at a buried via. Intermittent failures in the field often leave no obvious signature at all. At Aremac Labs, we approach every PCBA investigation with a structured methodology — starting with non-destructive analysis and building toward targeted destructive techniques — so that evidence is preserved and root cause is confirmed rather than assumed.
What we investigate
Our PCBA failure analysis covers solder joint fatigue and fracture, delamination and measling, conductive anodic filament (CAF) growth, electrochemical migration, tin whisker formation, flux residue contamination, coating adhesion failures, via barrel cracking, and component damage from ESD or thermal overstress. Whether you have a single failed unit or a pattern of field returns, we scope the investigation to find what is actually causing the failure.
How we analyse
Every investigation begins with optical microscopy and X-ray imaging to map the failure without destroying evidence. We then use SEM and EDX to characterise fracture surfaces, identify contaminants, and confirm material composition. Where needed, precision cross-sectioning exposes the failure site in cross-section for full microstructural analysis. We document every step so findings are reproducible and defensible — including in legal or regulatory contexts.
Why India's environment matters
India's high ambient humidity and temperature accelerate failure modes that standard IPC test protocols were not designed to catch. Electrochemical migration, tin whisker growth, and corrosion under conformal coating all progress faster in Indian operating conditions. Our analysis is calibrated to account for local climate exposure — not just what the datasheet says the component should tolerate.
What you receive
You receive a structured failure analysis report with optical and SEM images, EDX spectra, a confirmed root cause, and specific corrective and preventive action (CAPA) recommendations. Reports are written to be understood by both engineering teams and management, and are suitable for use in supplier negotiations, warranty claims, or product liability matters.